Event
HDI PCBs | Enabler for Chip Packaging, Mobility and Defense
22. June 2026
10:00 - 17:00
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Together with our partners - FED e.V., VDMA e.V. and ZVEI e.V. - PCB Network Business Solutions and Bayern Innovativ would like to invite you to the anniversary event of the PCB Conference. On June 22, 2026 in Nuremberg.
Welcome to the 20th PCB Forum with accompanying trade exhibition
You can look forward to meeting well-known experts from past PCB events, holding personal discussions and initiating new collaborations. In the usual setting - with exciting presentations and an accompanying trade exhibition - we will inform you about technological innovations and the enormous
range of possible applications for printed circuit boards.
This year, the focus will be on three subject areas for which the printed circuit board acts as an enabler: chip packaging, mobility and defense.
We are particularly looking forward to the keynote speech: "Defense and Mobility in Bavaria" by
- Tobias Gotthardt | State Secretary in the Bavarian Ministry of Economic Affairs
The technological overview presentation will be given by
- Dr. Andreas Ostmann | Head of SIIT Department, Fraunhofer IZM
We will look at each of these three topics from the perspective of leading PCB manufacturers, including:
- Nicolas Schweizer | CEO,Schweizer Electronic AG
- Daniel Klein | CEO, Würth CBT
- Michael Gössler | Head R&D BU ES, AT&S
In contrast, well-known OEMs/TIER 1 will present their requirements for electronics.
In the concluding panel with State Secretary Tobias Gotthardt, we will discuss, among other things, the question of how printed circuit boards can contribute to achieving technological sovereignty in safety-relevant areas.
Hans-Joachim Friedrichkeit pcb network,
Dr. Andreas Ostmann Fraunhofer IZM,
Moderation
Moderation
Bayerisches Staatsministerium für Wirtschaft, Landesentwicklung und Energie,
Bayerisches Staatsministerium für Wirtschaft, Landesentwicklung und Energie,
Parallel to the event, we offer you the opportunity to participate as an exhibitor in the accompanying trade exhibition.
The exhibition offers you an ideal platform to present your technologies, products and services in an innovation-oriented environment.
Exhibition contribution
| Category | Price (gross)*/ Price (net)* |
|---|---|
| Business / research organization | € 1.249,50 / € 1.050,- |
| University / public authority | € 702,10 / € 590,- |
This price includes the following services:
- Basic infrastructure for your stand (area 3.75 m² (2.5 x 1.5 m), power connection, 1 table, 2 chairs)
- Organizational support by employees of Bayern Innovativ GmbH
- 2 exhibitor passes (incl. participation in the event, catering). The full participation fee will be charged for each additional exhibitor pass.
Our exhibiting companies/institutions 2026 (more to follow)
Finetech is a global supplier of high-precision equipment for die bonders and SMD rework machines and has been supporting applications in the semiconductor, photonics and AVT industries for over 30 years.
We support our customers from the initial feasibility study and process development through to scalable, automated production.
Limata is an innovative supplier of advanced direct imaging (DI) systems for the printed circuit board and chemical mold etch and related markets.
Based on our proprietary, in-house developed exposure technologies, our product portfolio ranges from DI system configurations for niche, high-volume and emerging PCB applications to fully automated DI system solutions for mass production.
Whether engineering office, hidden champion or global player - for more than 18 years, many successful companies have placed their trust in our first-class services in the field of high-end embedded electronic design.
We support the development departments with customized solutions from the circuit concept to prototype layouts to series production.
Benefit from our experience, flexibility and reliability. Take the decisive step forward with us - for "state of the art" electronic assemblies.
Our claim: 100% function - right from the first prototype!
Professional contact:
Organizational contact: