HDI PCBs | Enabler for Chip Packaging, Mobility and Defense

Welcome to the 20th PCB Forum with accompanying trade exhibition

You can look forward to meeting well-known experts from past PCB events, holding personal discussions and initiating new collaborations. In the usual setting - with exciting presentations and an accompanying trade exhibition - we will inform you about technological innovations and the enormous
range of possible applications for printed circuit boards.

This year, the focus will be on three subject areas for which the printed circuit board acts as an enabler: chip packaging, mobility and defense.

We are particularly looking forward to the keynote speech: "Defense and Mobility in Bavaria" by
- Tobias Gotthardt | State Secretary in the Bavarian Ministry of Economic Affairs

The technological overview presentation will be given by
- Dr. Andreas Ostmann | Head of SIIT Department, Fraunhofer IZM

We will look at each of these three topics from the perspective of leading PCB manufacturers, including:
- Nicolas Schweizer | CEO,Schweizer Electronic AG
- Daniel Klein | CEO, Würth CBT
- Michael Gössler | Head R&D BU ES, AT&S

In contrast, well-known OEMs/TIER 1 will present their requirements for electronics.

In the concluding panel with State Secretary Tobias Gotthardt, we will discuss, among other things, the question of how printed circuit boards can contribute to achieving technological sovereignty in safety-relevant areas.