Printed circuit board technology 2025 - Sustainable electronics and resilient supply chains

In this presentation, we will talk about the need for stable supply chains. Speaker Manuel Martin will show how strong production in Europe not only strengthens the resilience of supply chains, but also offers economic and strategic advantages.
Why are stable supply chains important? PCBs are the backbone of many key industries such as automotive, medical and data technology.
Without reliable PCBs, we cannot manufacture advanced electronic products. Stable supply chains are crucial to keep production running and strengthen resilience to external shocks. The benefits of strong production in Europe Resilience and independence: Europe needs to move away from dependence on Asia. Strong local production makes us more independent and resilient. Shorter delivery times: Local production shortens delivery times and allows us to respond more quickly to customer needs. Quality and innovation: European manufacturers are known for their quality and innovative strength. Strong production here promotes these qualities. Jobs and economic growth: Local production creates jobs and contributes to economic growth.

Key technologies for efficient heat dissipation: Innovations for high-performance PCBs

This presentation will focus on thermal management in high-performance applications. Haris Sabanovic will show how innovative technologies such as copper coins, T-coins and thick copper solutions can overcome the thermal challenges of e.g. transistors with high heat generation. Practical examples and application scenarios are used to illustrate how these key technologies increase the efficiency and reliability of PCBs in demanding applications. A must for anyone looking for future-proof solutions in the field of thermal management.

The future of the automobile will be shaped by digitalization, connectivity and new technological requirements. High-speed digital base materials are indispensable in this transformation, as they enable ultra-fast data transmission, high signal quality and thermal stability - essential properties for autonomous driving, electromobility and networked vehicle architectures.
The presentation highlights how these innovative materials solve challenges in the automotive industry. Practical examples will illustrate their application, for example in sensor platforms and communication networks with a focus on signal integrity, low loss factors and thermal stability.
Participants will learn how high-speed digital base materials are laying the technological foundation for autonomous driving, 5G connectivity and energy-efficient electric vehicles.

Sustainable electronics is crucial when it comes to minimizing the impact of electronics on the environment, using resources efficiently and maintaining the long-term health of the planet. In this presentation we answer the most important questions how packaging can support this trend.

On the road to green electronics, the PCB often plays the spoilsport when it comes to sustainability. The classic printed circuit board scores neither with its energy-intensive manufacturing processes, for example, nor with the materials used, which are difficult or impossible to recycle. We are currently a long way from a circular economy. This presentation is intended to provide a status quo and outlook on new processes and materials that can help to move the electronics world, and PCBs in particular, a little more in the direction of sustainability in the coming years.

The embedding of power electronic components is proving to be a technology of great interest to an increasingly broad range of users. The presentation will explain the technology used by Schweizer, show the current status of its introduction in the automotive industry and provide an insight into further developments.

Printed circuit boards are an indispensable basis for modern electronics. Until now, the focus of their development has mainly been on the use of copper as a conductive material.
This presentation will shed light on the possibilities offered by the use of alternative metals in printed circuit boards. This allows new functionalities to be integrated, such as resistors, temperature sensors, electrochemical electrodes or even superconducting structures.
The integration of such materials in printed circuit boards not only offers new fields of application, but also enables the simplification and miniaturization of existing solutions.
Examples include their use as miniaturized temperature sensors, as electrodes for direct contact in the body or as conductors for low-temperature applications.
The lecture is aimed at engineers, material scientists and technology developers working at the interface of electrical engineering and material innovation. Together we want to discuss how new materials can revolutionize the functionality and range of applications of printed circuit boards.

The enormous demand for computing power in AI applications is driving semiconductor technology as well as assembly and connection technology forward.
The ever-growing modules for computing accelerators and processors require the huge semiconductor surface to be divided into individual chiplets that are connected via high-density substrates, so-called interposers. Interposers, which are manufactured from silicon using wafer technology, offer a very high wiring density, but are associated with considerable costs. Organic interposers are widely used and inexpensive, but they are unlikely to be able to realize the structures below 2 μm structure width required in the future. Substrates based on glass enable a similar wiring density to silicon, but allow large, rectangular production formats and promise lower costs.
This presentation provides an overview of current processes, materials and development trends in the field of substrate technology.