Event

4th symposium on chip development - AI in chip design

25. March 2026

10:00 - 17:00

Fraunhofer IIS
Am Wolfsmantel 33
91058 Erlangen
Display in Google Maps

The Bavarian Chip Design Center (BCDC) cordially invited to the 4th Symposium on Chip Development, which was held in cooperation with the Bavarian Chips Alliance. This event was aimed at all interested parties in the field of IC design and the semiconductor ecosystem.

The Bavarian Chip Design Center (BCDC) is committed to further expanding chip design capabilities in Bavaria and providing companies, especially start-ups and SMEs, with easier access to chip design and the necessary supply chains. On Wednesday, March 25, 2026, participants experienced an exciting day at Fraunhofer IIS in Erlangen-Tennenlohe on the topic of "AI in chip design".

Overview

In the morning, participants gained a comprehensive insight into modern EDA tools that are supported by artificial intelligence. Various EDA providers, such as Cadence Design Systems or Siemens Digital Industries Software, will presented their available solutions, explained the functions they offer and demonstrated the added value these tools can provide in the IC design process.

In the afternoon, participants had the opportunity to experience first-hand how AI-supported applications are used in real projects. The focus was on practices, efficiency gains achieved and the concrete benefits for providers and users of IC design.

The breaks and get-together were used to network with industry experts and make valuable contacts.

Participation was free of charge.

Welcoming address by Prof. Dr.-Ing. Giovanni Del Galdo, Director of Fraunhofer IIS

Session 1: AI-based EDA tools in chip design: technologies and potential benefits

KEYNOTE
AI and Semiconductors: Where Growth Comes From and Where Value Accrues
Dr. Ondrej Burkacky, Managing Director Semiconductor, MGX

Presentations
Agentic AI: ushering into a new era of chip design
Klaus Cerny, Senior Account Technical Executive, Cadence Design Systems
AI - Lowering the Barrier to Silicon
Thomas Heurung, Technical Director EMEA, Siemens Digital Industries Software
The Impact of AI on Digital Back-End IC Design
Dr. Tobias Bjerregaard, Executive Director, AI , Synopsys Inc

Networking & finger food

Session 2: User perspective: AI-supported EDA tools in use

KEYNOTE
AI-Driven Chip Design - Accelerating Development Performance
Dr. Nico Wolf, Director | Head of High Tech/Silicon Engineering, Capgemini Engineering SA

Presentation
The Future of Competitive Analog Design: A Research Perspective on AI Agents
Dr. Andrea Bonetti, Technical Lead and Team Manager, Sony AI

Coffee break

Session 3: Tools for IC Design Optimization

Presentations
From Ground Truth to Trust: The Vital Role of Formal Verification in the Age of AI
Dr.-Ing. Mo Fadiheh, Head of R&D, LUBIS EDA GmbH
AI-Assisted HDL: What Works, What Breaks, and How to Control Risk
Lieven Lemiengre, Product Manager, Sigasi nv
AI Driven Analog Optimisation
David Conochie, Chief Sales Officer, IC Optimize ApS

Wrap up and outlook

Farewell with concluding get-together

The presentations will be held in German and English.

Moderation: Dr. Denise Müller-Friedrich, Head of Smart Sensing and Electronics, Fraunhofer IIS