RoodMicrotec GmbH

At RoodMicrotec, we work every day with one clear purpose: to make the world a safer, smarter, and more sustainable through trusted technology.
As part of the Microtest Group, we are the reliable partner for quality assurance in the semiconductor industry – enabling innovations that protect lives and shape a better future.

Our passion? To offer tailored ASIC solutions for automotive, medical, industrial, and other critical applications. We ensure that cutting-edge technologies perform with the reliability the world depends on, today and tomorrow.

As an independent and accredited test house, we ensure that technology delivers on its promise. From the idea to realization we cover the entire lifecycle of ASICS. Using state-of-the-art equipment and certified and accredited processes, we deliver the highest standards of quality, safety, and reliability.

Your Semiconductor Supply Chain Partner

RoodMicrotec is a leading independent provider for semiconductor testing, qualification, and failure analysis. With over 50 years of expertise, our ISO 9001 and ISO/IEC 17025 accredited laboratories in Germany ensure high reliability and quality for customers in automotive, industrial, medical, aerospace, and high‑performance markets.

We support your project at every stage — from ASIC Design to wafer testing, final assembly, reliability qualification, and full failure & technology analysis.

We specialize in:

• Wafer tests (6″–12″ wafers, AOI, end-of-line testing, environmental stress screening from –40 °C to +125 °C)
• Customized electrical/opto-electrical test program development (analog, digital, RF, power modules)
• Failure analysis and root-cause identification across chip, package, and module levels
• Packaging and test handling, including laser marking, tape & reel, and bumping solutions in grayroom to Class 6 cleanroom
• Support for Industry 4.0 integration and advanced packaging methods

• Turn‑key ASIC and semiconductor test flow: from test concept and program development to execution and data analysis
• Wafer & component testing: wafer-level AOI, burn-in, screening, temperature-cycle and parametric testing
• Failure & technology analysis: physical, electrical, and mechanical defect localization
• Qualification & reliability: VDA-compliant stress qualifications, Environmental and Reliability Testing
• Supply‑chain enablement: logistical support, packaging (e.g., QFN, TSSOP, BGA, CSP, WLCSP, PLCC, BGA), and traceable tape & reel
• Engineering support: test program conversion, optimization, characterization, and high-voltage module testing