SGS Institut Fresenius GmbH

WHEN YOU NEED TO BE SURE

SGS INSTITUT FRESENIUS advises and supports its customers in product development, manufacturing and processing in all quality-related tasks. With our Microelectronics & Special Analytics division, we are leaders in our services for the semiconductor industry, its suppliers and technologically related industries. Our strengths lie specifically in materials, surface and layer analytics, but also in the investigation of process media.

Documentation and evaluation of bonding by wire bonding: Defects on the wire, connection to the PCB Examination of different wire bonding systems, e.g. Au bonding wire, Al bonding wire Target preparation of complex components for the evaluation of bonding, soldering and adhesive connections Representation of local interface areas of contact surfaces: Formation of intermetallic phases, pressed joints during ultrasonic bonding Measurement and evaluation of solder joints according to IPC-A-610 Investigation and clarification of faulty welded and soldered joints due to adhesion problems during bonding (impurities, intermetallic phases, corrosion) Assistance with faulty contact and conductor track systems due to dendrite formation, for example due to silver migration Examination of doping profiles on semiconductor components Analysis of layer systems for defects: Formation of intermetallic phases, impurities, voids, whiskers, delamination Documentation, preparation and characterization of ceramic SMD failure components e. g.E.g. due to cracking, manufacturing defects Analysis of component counterfeits (fake chips)

Metallography / light microscopy Tactile profilometer Ultrasonic microscopy (SAM) Vickers hardness X-ray fluorescence analysis (XRF) Spark emission spectroscopy (F-OES) Chip opening (while retaining function) / chip recovery X-ray microscopy (XRAY) Scanning electron microscopy (SEM) & Energy dispersive X-ray spectroscopy (EDX) Focused ion beam (FIB) , inc. Circuit modification Scanning transmission electron microscope (STEM) Transmission electron microscopy (TEM) Secondary ion mass spectrometry (SIMS) Time-of-flight mass spectrometry (ToF- SIMS) Spreading resistance measurements (SRP) X-ray photoelectron spectroscopy (XPS) X-ray diffraction (XRD) Mechanical bond testing (shear, pull and compression tests) Fourier transform infrared spectroscopy (FTIR, ATR, IR microscopy, KBr press technique) Raman spectroscopy (microscopy) Ion chromatography (IC) Thermogravimetry (TG) Differential scanning calorimetry (DSC)