Elektrotechnik Weber

As a competent service provider, we are available to you since 2013 in the specialist areas of component processing, contract cleaning and repair & rework. These and further special requests are examined in detail and answered promptly.

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Extended workbench for EMS' Ier

• Assemblies / PCB contract cleaning
• Test scope to the cleaning result
• Ionic contamination < 0.4 1µg/cm2 NaCI equivalent
• Surface tension > 40 mN/m
• No activator residues (eg.E.g. ZESTRON® Flux Test residue-free)
• Resin-free (e.g. ZESTRON® Resin Test residue-free)

This ensures that the assemblies are clean according to the requirements. The cleaning process is constantly monitored in series production, so the consistent quality is secured.

• BGA assembly and BGA rework
• Destruction-free X-Ray analysis
• Assembly rework and repairComponent replacement SMT and THT
• Gold contact repair
• Repair of gold surfaces of assemblies that have tin spatter or wear.
• SMD assembly:
• Samples
• Prototypes
• Small series
• Medium series

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