Event

3rd Symposium on Chip Development: Innovations and trends in the semiconductor industry

9. April 2025

10:00 - 18:00

Fraunhofer IIS
Am Wolfsmantel 33
91058 Erlangen
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The Bavarian Chip Design Center (BCDC) has set itself the goal of further expanding chip design capabilities in Bavaria and providing companies, especially start-ups and SMEs, with easier access to chip design and the necessary supply chains.

Overview

The BCDC in cooperation with the Bavarian Chips Alliance cordially invited to the 3rd Symposium Chip Development on Wednesday, April 9, 2025. The event was aimed at anyone with an interest in IC design and from the semiconductor ecosystem.

Program

Keynote on "Advanced Packaging / Chiplets - New Opportunities in Chip Design" by Bernd Waidhas, Principal Engineer - Silicon Packaging Architecture, Intel Deutschland GmbH
Further inspiring presentations and insights into current developments: ASICs in application, research trends in IC design and the latest supply chain information from foundries and test houses
Panel discussion: Shortage of skilled workers and the promotion of skilled workers in microelectronics
Networking opportunities: During the breaks and at the get-together, participants exchanged ideas with industry experts and made valuable contacts.

Participation was free of charge.