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Printed circuit board technology 2023 - The printed circuit board, an important building block for an all-electric society
26. April 2023
10:00 - 17:00
Together with our partners - FED e.V., VDMA e.V. and ZVEI e.V. - we at PCB Network Business Solutions and Bayern Innovativ look forward to welcoming you to the Erdinger Stadthalle on April 26, 2023, as we did last year. You can look forward to seeing well-known experts from past PCB events, holding personal discussions and initiating new collaborations. In the usual setting - with exciting presentations and an accompanying trade exhibition - we will again inform you about technological innovations and the enormous range of possible applications for printed circuit boards. This year with the…
Fachverband für Design, Leiterplatten- & Elektronikfertigung 
VDMA Verband Deutscher Maschinen- und Anlagenbau e.V. 
ZVEI e. V. Verband der Elektro- und Digitalindustrie 
Fachzeitschrift Plus 
Vogel Communications Group 
Our exhibitors 2023:
Bavarian Chips Alliance www.bayern-innovativ.de/bavarian-chips-alliance 
CiBOARD electronic GmbH www.ciboard.de 
FED e.V. www.fed.de 
GulTech Europe www.gultech.eu 
LaserJob GmbH www.laserjob.de 
Luminovo GmbH www.luminovo.ai 
Notion Systems GmbH www.notion-systems.com 
Polar Instruments GmbH www.polarinstruments.eu 
Rogers Corporation www.rogerscorp.com 
Varioprint AG www.varoprint.ch 
Ventec International Group www.venteclaminates.com The increasing power requirements for automotive applications bring new challenges for printed circuit boards. Today's power electronic applications are sometimes very complex, assembly-intensive designs. It will be shown how new PCB technologies can help to carry the highest currents, dissipate power losses, help with miniaturization, achieve high power densities and minimize the system complexity of power electronic applications.
The miniaturization of microchips is slowly reaching its physical limits. In the future, further increases in computer performance will therefore increasingly be made possible by closely connecting several chips to form a powerful computing unit, which are linked together in so-called "heterogeneous packages". IC substrate and PCB technologies of the future will make it possible to efficiently bundle many microchips in a very small space and thus make an important contribution to technical progress in the semiconductor industry.
The lecture will present novel sensor concepts based on printed circuit boards for monitoring current densities and temperatures in fuel cell stacks. This involves a spatially resolved representation of the current and temperature distribution between the bipolar plates. This provides online information about the operating status. This information is highly useful for the development of designs and materials for the individual components of a fuel cell.
This principle can also be implemented in flexible printed circuit boards, allowing information about hotspots to be obtained in many other applications - spatially resolved and online. This can be used, for example, to monitor mobile or stationary systems for converting and storing large amounts of energy.
Energy efficiency is on everyone's lips today, with sensors and infrared sensors in particular making an important contribution to the effective use of energy. Mains-independent energy consumers such as laptops, earbuds or locks can be operated in energy-saving mode, and applications can be operated for longer or with smaller battery capacities using sensor technology. VARIOPRINT shows how conventional infrared sensors can be made smaller and more agile using proven and innovative technology and how new types of products can be developed to industrial production maturity in cooperation with the supply chain.
In recent years, the world of PCBs with embedded components has increasingly developed into a technology for new and innovative solutions. It has opened up technological paths that were previously unthinkable. This presentation shows that the journey is not yet over:
Through a brief overview of the research work in the field of sensor technology and industrial IoT solutions for their improved tolerance to harsh industrial environments through the use of embedded components, the presentation leads to an award-winning example of maximum packaging and functional density in the smallest possible space with integrated active and passive components, as well as embedded sensors that require media access.
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