F & K DELVOTEC Bondtechnik GmbH

F&K DELVOTEC Bondtechnik GmbH is a leading global specialist for innovative micro-assembly and bonding technologies using ultrasonic and laser bonding. Technology leader with over 40 years of experience and numerous patents. Our customers are global players in the automotive, aerospace and medical technology industries. The company has been part of the Strama Group since 2014.

The company develops and produces high-end systems for wire bonding. The finest wires made of gold, aluminum or copper are used to produce electrical connections in semiconductors and electronic assemblies.

The technological focus is on

• Laser bonding: with pioneering work in the combination of laser technology and ultrasonic bonding
• Power modules: Solutions for electromobility (e.g. battery contacting) and renewable energies
• Automation: Fully automated production lines for the semiconductor industry
• Software: Proprietary systems for process monitoring and quality control (Quality Monitoring)

Technology / Research

In the field of wire bonding, F & K DELVOTEC develops integrated semi-automated or fully automated solutions in assembly and connection technology (AVT) for customers from the semiconductor industry, e-mobility, photovoltaic industry and automotive industry. The all-round service ranges from application consulting, selection and configuration of the wire bonding machine to the connection of buffer stations and magazines as well as the integration of feeding systems.

Products / services

• Fully automatic ultrasonic wire bonders for all common joining technologies in AVT
• Laser bonders for large connection cross-sections and high-precision TAB bonding of contacting systems
• Consulting, feasibility studies and process development