A research team from Rigaku SE and Fraunhofer IISB has jointly developed a unique, industrial-grade characterization method for semiconductor materials. For the first time, the setup of the X-ray topography system was combined with the development of corresponding algorithms for defect detection and quantification. The method is ideally suited to silicon carbide (SiC) - an excellent semiconductor for areas such as electromobility and transportation, sustainable energy supply, industrial infrastructure, sensors and quantum technologies. The scientists Dr. Kranert and Dr. Reimann from Fraunhofer IISB and Dr. Hippler, Managing Director of Rigaku Europe SE, were awarded the Georg-Waeber Innovation Prize 2023 by the Förderkreis für die Mikroelektronik e.V. for this achievement.
As the "Center of Expertise for X-ray Topography", Rigaku SE and Fraunhofer IISB operate a joint lab at the IISB's main site in Erlangen. Here, the researchers have succeeded in linking X-ray topography and defect detection software to enable quality control of SiC-based power electronics at substrate and crystal level. By using X-ray topography, defects on the entire wafer surface can be characterized non-destructively, quickly, with high resolution and at a high throughput rate. In industry, however, wafers are currently often etched and disposed of for characterization. The new process therefore not only promises considerable cost savings, but also an increase in efficiency in the production of SiC power electronics. This is ideal for a wide range of applications, such as the mobility sector, and is becoming increasingly relevant due to the electrification of society as a whole.
Dr. Michael Hippler, Managing Director of Rigaku Europe SE, Dr. Christian Reimann and Dr. Christian Kranert from Fraunhofer IISB with their award certificates in front of the Rigaku XRTmicron X-ray topography device in the Center of Expertise for X-ray Topography at IISB.
The success of this joint innovation is also reflected in the fact that Rigaku has successfully developed a new business area in less than two years and is now the world's leading provider of XRT tools in the field of SiC substrate and device manufacturing. Based on the technology developed in Germany, this measurement method meets all the requirements for a common, global standard language for substrate and device manufacturers to specify and control substrate quality in production and research.
The innovative metrological approach was largely driven by Dr. Michael Hippler, Managing Director of Rigaku Europe SE, and Dr. Christian Kranert with Dr. Christian Reimann, both group leaders at Fraunhofer IISB. The scientists were selected for the Georg-Waeber Innovation Award 2023 of the Förderkreis für die Mikroelektronik e.V., which they received at the award ceremony at the IISB in Erlangen on October 25, 2023. The prize is awarded annually for outstanding scientific achievements. In the jury's assessment, particular consideration is given to the progress of knowledge in microtechnology and emphasis is placed on practical utilization by industry.
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