Review

Chips for a Connected World

29. November 2023

10:00 - 14:30

Design Offices München Atlas
Rosenheimer Str. 143C
81671 München
Deutschland
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Join us on the of November, 2023, for a cooperational event between the and Thinknet 6G, as we invite you to the Atlas Design Offices in Munich for a captivating morning filled with insightful presentations and discussions centered around the future landscape of chips and 6G.

Chips for a Connected World

Join us on the 29th of November, 2023, for a cooperational event between the Bavarian Chips Alliance and Thinknet 6G, as we invite you to the Atlas Design Offices in Munich for a captivating morning filled with insightful presentations and discussions centered around the future landscape of chips and 6G.

Immerse yourself in the expertise of distinguished speakers as well as esteemed representatives from prominent entities from industry as well as research. They will shed light on exciting new trends, innovations and ongoing activities regarding semiconductor / chips and 6G technology and their significance in shaping the realms of business and everyday life for a connected world.

The event not only offers a unique opportunity to delve into the forthcoming era of communications but also provides an ideal platform for networking with fellow experts and enthusiasts within the domain.

Organizational

  • The event will be held in English
  • Attendance is free
Start of the event
Start the Day with Coffee and Networking
Welcome
from Bavarian Chips Alliance / Thinknet 6G / Bayern Innovativ
Matthias Hafner
Digitization, Project Manager, Bayern Innovativ GmbH, Nuremberg
Dr. Malte Kohring
Digitization, Project Manager, Bayern Innovativ GmbH, Nuremberg
Chips for IoT Devices
IoT for accelerating digital transformation
Ulrich Bauernschmitt
Senior Vice President Operations, Managing director RG360 Europe GmbH and Global Leader Operations RF360, Qualcomm Germany RFFE GmbH
ICPEI ME/CT - European Microelectronics and Communication Technologies for 6G
Dr. Thomas Merkle
Project Manager / Technical Lead, Ericsson Antenna Technology Germany GmbH
How 6G will impact IoT from a 360-degree end-to-end solution provider perspective
Günter Maximilian Hefner
Managing Director, eesy-innovation GmbH
Evolution of RF chips enabling a connected world
Markus Lörner
Market Segment Manager RF & Microwave Components, Rohde & Schwarz
Panel Discussion about the need and the requirements for chips in communication
Panel discussion
Hannes Rügheimer
Author of the annual Netztest, Connect Magazine
Markus Lörner
Market Segment Manager RF & Microwave Components, Rohde & Schwarz
Dr. Ferdinand Bell
Head of Public Cooperative Programs, NXP Semiconductors Germany GmbH
Prof. Dr. Sebastian Steinhorst
Professor, Technical University of Munich
Dr. Ing. Stefan Schindler
Business Development Manager, Infineon AA
Lunch
Time for Lunch and Networking
End of event