Description of the component:
Alumina Systems has already won an award for the predecessor of the ceramic-metal composite ring for ALD (Atomic Layer Deposition) coating of silicon wafers. In addition to the use of corrosion-resistant Al2O3, the 3D-printed ceramic nozzles were the key to the success of this product. Even with this version, the coating time in the semiconductor industry was more than halved. At the same time, the service life of the coating ring was increased many times over compared to the more corrosion-prone metal version.
Innovation and solution:
In close cooperation with the company Plasway-Technologies GmbH, Alumina Systems developed the two new generations of the 3D-printed ceramic ALD ring on the world's largest 3D printer (3DCeram) for the production of dense Al2O3 ceramics. In these versions, the nozzles are not inserted into the ceramic ring using glass solder - as was the case with the original version - but the rings are 3D-printed including the nozzles. A ring with a diameter of 380 mm was first produced using this process. However, as the requirements in the semiconductor industry are increasing, the diameter of the wafers to be coated is also growing. Therefore, based on this experience, an ALD ring with a diameter of 500 mm was also developed and produced.
In order to achieve a significant reduction in manufacturing costs, the innovative approach of a modular concept was pursued. The ring is printed in segments and, after sintering the ceramic with glass solder, is rejoined gas-tight to form a complete ring. This has the advantage that the segments can be arranged on the printing platform to save space and up to four rings can be produced per print job. Segmentation significantly reduces the manufacturing risk compared to a printed complete ring. By joining using glass solder, Alumina Systems is once again using one of its core competencies to create the overall component. Finally, metallic gas filling nozzles are soldered to the 3D-printed ceramic, which ensure the introduction of the reaction gases. In order to meet the requirements of the semiconductor industry, ALD rings with a significantly larger diameter of up to 500 mm can now be produced for coating wafers.
Conclusion:
In close cooperation with equipment manufacturer Plasway-Technologies GmbH and using the world's largest ceramic 3D printer, Alumina Systems has been able to take ALD coating technology to a new level. However, Alumina Systems is not resting on the laurels of its developments: Further diameters for even larger wafers are being planned. In addition, the company is currently working on a new 3D printing process that will enable even larger ceramic components with greater wall thicknesses to be produced even faster.