Event
3rd Symposium on Chip Development: Innovations and trends in the semiconductor industry
9. April 2025
10:00 - 18:00
The Bavarian Chip Design Center (BCDC) has set itself the goal of further expanding chip design capabilities in Bavaria and providing companies, especially start-ups and SMEs, with easier access to chip design and the necessary supply chains.
The BCDC in cooperation with the Bavarian Chips Alliance cordially invites you to the 3rd Symposium Chip Development on Wednesday, April 9, 2025. This event is aimed at anyone with an interest in IC design and from the semiconductor ecosystem.
What can you expect?
- Keynote on "Advanced Packaging / Chiplets - New Opportunities in Chip Design" by Bernd Waidhas, Principal Engineer - Silicon Packaging Architecture, Intel Deutschland GmbH
- Further inspiring presentations and insights into current developments: ASICs in application, research trends in IC design and the latest supply chain information from foundries and test houses
- Panel discussion: Discuss with experts about the shortage of skilled workers and the promotion of skilled workers in microelectronics
- Networking opportunities: Take advantage of breaks and the get-together to exchange ideas with industry experts and make valuable contacts.
A detailed agenda with all speakers and the participants in the panel discussion will be added in the coming weeks.
Be part of this exciting event and actively shape the future of chip design!
Participation is free of charge.
Jürgen Frickinger
+49 911 20671-160
Head of Bavarian Chips Alliance, Digitization, Bayern Innovativ GmbH, Nuremberg
You might also be interested in
AdobeStock/javu,
Fotolia/vizafoto,
iStock©Kinwun,
Holger Czuday, Bayern Innovativ; Thomas Regnet,Scherdel INNOTEC Forschungs- und Entwicklungs-GmbH,
