Without chiplets soon nothing works

09/12/2023

For the success of large semiconductor manufacturers, advanced packaging and especially the handling of chiplets will be a decisive criterion in the future. However, this topic can also be of importance for medium-sized companies.

Since this is new and there is still a need for clarification here, Fraunhofer IIS/EAS is working together with companies from the semiconductor industry to make chiplets attractive for companies.

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