LINTEC Advanced Technologies (Europe) GmbH

Semiconductor-related adhesive tapes and equipment: Leveraging its comprehensive tape and equipment proposal capabilities, LINTEC is making innovative propositions for mounting and back-end process solutions that contribute to the production of thin, compact, high-density semiconductor packages as well as simpler manufacturing processes

The unique advantage of using LINTEC products is the power to create comprehensive semiconductor solutions by combining expertise in Tape x Equipment

LINTEC specializes in proprietary semiconductor manufacturing related products, registered under the trademark Adwill. Our Adwill product line features highly-functional adhesive tapes, both UV and non-UV curable, for the dicing and grinding process, as well as Die-Attach (DAF) and Backside Coating Films. LINTEC is also one of the industry leaders in designing Fully-Automatic semiconductor manufacturing equipment for BG Tape Lamination, BG Tape Peeling, Wafer Mounting and UV Irradiation.

• Semiconductor manufacturing related tape
• Semiconductor manufacturing related equipment
• Technical consulting and support for dicing, grinding, and pick-up related questions
• Technical consulting and support for all questions related to UV Irradiation processes
• Technical consulting and support BG Tape Lamination and Peeling processes
• Technical consulting and support for Wafer Mounting and UV Irradiation processes

• Design and development of semiconductor manufacturing related tape and equipment